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A NEW ERA IN PERFORMANCE
DDR3 is the next generation DRAM technology that will become the
mainstream technology and is rapidly gaining adoption. By improving
performance and lowering power this technology will continue to
enable advancements in computer systems for a long time.
Key features of
this technology include:
• Lower power supply
voltage of 1.5 volts versus 1.8 volts of DDR2
• Doubling of the transfer rates to a maximum of 1600 Million
transfers per second (MTS) (DDR3-1600)
• Inclusion of a RESET pin for easier memory system initialization
• Incorporation of a “Fly-by” DIMM layout architecture
for simplified motherboard layout and more precise data capture
• New register architecture that combines the register and
PLL into one chip, saving space and providing enhanced configuration
options
• Improved chip package and pinout for enhanced reliability
and performance
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Form
Factor and Speeds
The DDR3 modules will initially
be available in the following form factors:
• 240-pin Unbuffered DIMM without ECC (x64 width)
• 240-pin Unbuffered DIMM with ECC (x72 width)
• 240-pin Full-height Registered DIMM with ECC (x72 width)
• 240-pin Very Low Profile (VLP) Registered DIMM with ECC
(x72 width)
• 204-pin Unbuffered So-DIMM (x64 width)
Additional
form factors will become available as the technology matures.
The configurations will initially be available at speeds of PC3-6400
(DDR3-800), PC3-8500 (DDR3-1066), and PC3-10600 (DDR3-1333) with
an eventual speed grade of PC3-12800 (DDR3-1600).
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