NASDAQ  STEC  |  Contact  |  Sitemap
Home > Technology > IC Tower® TSOP Stacking

IC TOWER® TSOP STACKING

STEC Products for IC Tower Stacking Technology

STEC invented the concept of SSD/FLASH and DRAM stacking in 1995 and we have multiple patents covering this technology. We have built many millions of SSD/FLASH and DRAM stacks over the past 13 years.

We develop this by stacking two chips, one on top of each other, and connected by a "rail" board. Most of the address and data lines of the two chips are tied together with only the chip selects separated out electrically. When the module is in operation, either the top chip or the bottom chip is selected and the data is accessed.

The TSOP stacks have undergone extensive reliability testing to ensure long life operation without problems. Our quality and reliability department has subjected stacked modules to multiple tests in the following areas: temperature cycles, temperature humidity bias (THB), bend, torque, shock, vibration, and electrical characterization.

  Related Products
  ZeusRAM™ SSD
  MACH16™ SSD
  MACH8IOPS™ SSD
  MACH8™ SSD
  DDR3
  DDR2

  Related Interface
  Fibre Channel (FC)
  Serial Attached SCSI (SAS)
  SCSI
  Serial ATA (SATA)
  IDE (Parallel ATA)

  Related Applications
  Enterprise Computing
  Communications/Networking
  Automotive
  Embedded/Industrial
  Military/Aerospace
  Medical Equipment
  Casino Gaming
  Professional Media

 

PRODUCT SEARCH  
©2012 STEC, Inc. All Rights Reserved. |  Terms and Conditions  |  Privacy Policy  |  Warranty Terms
Share